The company is a startup specializing in the research, development, and services related to high-power semiconductor packaging technology, with the goal of addressing pain points in the power semiconductor industry through the development of advanced semiconductor bonding materials. The company was established and registered in September 2023. Its core members are part of the research team from the Department of Mechanical Engineering at the University of Hong Kong. This project focuses on the development of advanced semiconductor packaging materials, falling under the high-performance materials industry cluster, which aligns with Shenzhen's “20+8” strategic emerging industry clusters and future industry clusters development direction. The company focuses on utilizing physical metallurgy and nanotechnology to develop advanced alloys that outperform traditional chip packaging materials, overcoming the shortcomings of traditional materials ...